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7,232,315 Title:
Connection structure for printed wiring board
A connection structure for a printed wiring board which enables high density integration is provided. A FCP 2 includes an exposed conductor part 2A including an insulating substrate 22 and a reinforcing plate 24 stacked with this substrate 22 via an elastic member 23. In the exposed conductor part 2A, conductors 21 each having a protrusion 20 formed on a surface is placed on the insulating substrate. The exposed conductor part 2A can be elastically deformed in the thickness direction in which the substrate 22, the reinforcing plate 24 and the like are stacked. A printed wiring board 1 is constructed by stacking an inner layer board 10 and a first outer layer board 11 and a second outer layer board 12 which sandwich this inner layer board 10. A notched groove 10A is formed on the inner layer board 10, and an insertion opening 10B is formed. Through-hole ports 11 which appear on the notched groove 10A side is placed on the first outer layer board. When the FPC 2 is inserted into the insertion opening 10B, the protrusion 20 of the FPC 2 fits with the through-hole port 11A from within insertion opening 10B and presses thereto.
The invention claimed is:
1. A connection structure for a printed wiring board for electrically connecting a FPC and a printed wiring which is electrically connected to this FPC, wherein: saidFPC comprises a board-shaped substrate and has an exposed conductor part which can be elastically deformed in the thickness direction; said exposed conductor part has an exposed surface on a surface of said substrate onto which a plurality of conductorsis placed; said conductor comprises a protrusion on a surface which protrudes from said substrate; said printed wiring board is formed by stacking a plurality of base plates and comprises an insertion opening into which said FPC is inserted in an edgesurface parallel to the stacking direction of said base plates and a plurality of through-hole ports provided on an inner wall surface of said insertion opening; and said protrusions of said FPC is connected to said through-hole port of said insertionopening and pressed thereto when said FPC is inserted into said insertion opening of said printed wiring board.
2. The connection structure for a printed wiring board according to claim 1, wherein said exposed conductor part of said FPC comprises a board-shaped substrate formed from an insulating material and a reinforcing plate which is stacked withthis board-shaped substrate with an elastic member sandwiched in between.
3. The connection structure for a printed wiring board according to claim 1, wherein: said exposed conductor part of said FPC comprises a board-shaped substrate formed from an insulating material and an elastic reinforcing plate stacked inclose contact to this substrate, is bent in the thickness direction which is the direction in which said substrate and said elastic reinforcing plate are stacked to form a crease perpendicular to this thickness direction; and said conductor is arrangedin alignment along this crease.
4. A connection structure for a printed wiring board for electrically connecting a FPC and a printed wiring which is electrically connected to this FPC, wherein: said FPC has an exposed conductor part comprising a board-shaped substrate formedfrom insulating material and a reinforcing plate which is stacked in close contact with this substrate; said exposed conductor part has an exposed surface on a surface of said substrate onto which a plurality of conductors are placed and is insertedinto the printed wiring board by contacting an insertion jig closely to said reinforcing plate and; said conductor comprises a protrusion on a surface which protrudes from said substrate; said insertion jig comprises a lead part which is inserted intosaid printed wiring board and a locking part for locking said FPC; said lead part is formed from an elastic material having the same width as said exposed conductor part of said FPC, is bent in the thickness direction which is the direction saidsubstrate and said reinforcing plate of said exposed conductor part is stacked to form a crease which extends in the direction perpendicular to the thickness direction; said locking part comprises a pair of locking pieces for locking said FPC; saidprinted wiring board is formed by stacking a plurality of base plates and comprises an insertion opening into which said FPC is inserted on an edge surface parallel to the stacking direction of said baseplates and a plurality of through-hole portsprovided on an inner wall of this insertion opening; and said protrusion of said FPC is connected to said through-hole port of said insertion opening and pressed thereto when said FPC is inserted into said insertion opening of said printed wiring board.
5. A connection structure for a printed wiring board according to claim 1, wherein: said printed wiring board comprises a first outer layer board, a second outer layer board, and an inner layer board which is placed between said first outerlayer board and said second outer layer board; a notched groove into which said exposed conductor part of said FPC is inserted is formed on said inner layer board; said first outer layer board comprises a plurality of through-hole ports which penetratesaid first outer board, and said insertion opening is formed on an edge surface parallel to the stacked direction in which said first outer layer board, said second outer layer board, and said inner layer board are stacked.
6. The connection structure for a printed wiring board according to claim 1, wherein: said protrusions protrude spherically.
7. The connection structure for a printed wiring board according to claim 1, wherein: said protrusions protrude in a pyramid-shape.
8. The connection structure for a printed wiring board according to claim 6, wherein: said protrusions are aligned in a row.
9. The connection structure for a printed wiring board according to claim 5, wherein: said inner layer board is formed in said printed wiring board from insulating plate; said first outer layer board and said second outer layer board aredouble-sided copper-clad laminating sheets onto which wire patterns are formed; and said inner layer board, said first outer layer board, and said second outer layer board are stacked and connected sterically in the thickness direction by solder platingmethod.
10. The connection structure for a printed wiring board according to claim 9, wherein: a wiring pattern is formed respectively on double-sided copper-clad laminated sheets in said first outer layer board and said second outer layer board insaid printed wiring board; and a prepreg and a copper foil are further stacked between said first outer layer board and said second outer layer board and are connected sterically in the thickness direction by solder plating method.
11. The connection structure for a printed wiring board according to claim 9, wherein: a plurality of through-hole ports are exposed on said notched groove formed on said printed wiring board, and a plurality of line patterns parallel to thedirection in which said FPC is inserted extends from said through-hole ports to an outer edge part of said multilayer printed wiring board, in these through-hole ports; and hard plating is applied onto said plurality of line patterns.